SNEAK PEEK: First insights in the not-yet-published Annual Report 2021/2022 / 2022
High-precision reactive joining technology for microsystems engineering

Fraunhofer IWS is working on a new evolutionary stage of reactive joining. In future, reactive multilayer systems (RMS) will join sensors and other components in the field of microsystems engineering as direct coating on wafers and components or as thin films in a particularly gentle and environmentally friendly way - using less energy and yet much faster than the joining technologies used so far.
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