MoReBond

Motivation

For several years, reactive multilayer systems (RMS) have been intensively studied for use in packaging technology (AVT) for various components. While the basic principle has been understood at least for some time, there are still many unanswered questions for specific applications in packaging technology. The RMS and solder coating selection and dimensioning are of particular importance, since a spatially and temporally incorrectly dosed energy distribution can result either in damage to the component or in low strengths of the joints. Generally, however, dimensioning occurs only based on empirical values from a limited number of preliminary tests or, ultimately, on available RMS standard films. A safe and reliable joining process is therefore not always ensured and the potential of RMS technology remains partially unused.
 

Aims and procedure

The AiF project aims at gaining a deeper process understanding of reactive joining, in particular with regard to dynamic aspects. By precise modeling using modern numerical simulation tools and their optimization, the spatial and temporal heat and stress distribution both within the joining zone and in the adjacent component are to be determined. The optimum RMS properties and the process parameters for reactive joining without prior, time-consuming test series can thus be determined. A subsequent comparison of the actual joining tests with the simulations provides feedback on the input data for the modeling. If the simulation results are successfully verified, selected demonstrators can be created. Finally, the collected results will be summarized in a process manual.
 

Innovations and perspectives

By designing an elaborate simulation model, the entire RMS potential is to be demonstrated. Thus, the way will be opened to apply the RMS technology in a wide range of applications, such as microsystem and medical technology or in the automotive and lightweight construction sector.