![Ion beam sputtering equipment for nanometer precision coating- and etching processes Ion beam sputtering equipment for nanometer precision coating- and etching processes](/en/technologyfields/pvd_nanotechnology/xray_euv_optics/technologies/precision_coating/ion-beam-sputter-deposition/jcr:content/contentPar/sectioncomponent/sectionParsys/textblockwithpics/imageComponent1/image.img.jpg/1646402361696/ibsd-anlage-400x340.jpg)
Ion beam sputtering equipment for nanometer precision coating- and etching processes
![IBSD process in view of the primary ion beam for target sputtering processes IBSD process in view of the primary ion beam for target sputtering processes](/en/technologyfields/pvd_nanotechnology/xray_euv_optics/technologies/precision_coating/ion-beam-sputter-deposition/jcr:content/contentPar/sectioncomponent/sectionParsys/textblockwithpics/imageComponent2/image.img.jpg/1646402330474/ibsd-prozess-beschichtung-400x300.jpg)
IBSD process in view of the primary ion beam for target sputtering processes
![IBSD process in view of the secundary ion beam for substrate treatments (cleaning,smoothing, contouring) IBSD process in view of the secundary ion beam for substrate treatments (cleaning,smoothing, contouring)](/en/technologyfields/pvd_nanotechnology/xray_euv_optics/technologies/precision_coating/ion-beam-sputter-deposition/jcr:content/contentPar/sectioncomponent/sectionParsys/textblockwithpics/imageComponent3/image.img.jpg/1646402521841/ibsd-prozess-substratbehandlung-400x300.jpg)
IBSD process in view of the secundary ion beam for substrate treatments (cleaning,smoothing, contouring)
Layer fabrication
- fabrication of focused ion beams in ion sources
- sputtering of the targets by impact processes between the particles of the primary source and the target atoms
- condensation of the sputtered particles on the substrate’s surface
Process conditions
- vacuum: p ~ 2 x 10-8 mbar
- ion sources: primary source for target sputtering processes and a secondary source for film growth modifications (assist operation) or for surface modifications of the substrate (cleaning, smoothing)
- ion source activation: electron cyclotron resonance (ECR)
- number of targets: 6
- target size: 400 mm x 200 mm
- substrate size: load-lock up to a diameter of 200 mm, larger substrates of up to 500 mm have to be operated by hand through the chamber door
Advantages of the IBSD procedure with linear ion sources
- high flexibility for process parameter
- high suitability for reactive sputtering processes
- films with low damage densities
- extremly smooth layers
- simple scalability to larger geometries
- large-area homogenous coatings
Applications
- fabrication of ultra smooth precision layers
- EUV reflection layers on non-perfect smooth substrate surfaces
- multilayer synchrotron optics
- nanometer multilayers for lab X-ray optics
- heat insulation layers (ZrO2, ...)
- XUV reflection layers
- monochromator for X-ray fluorescence analysis
- dieelectric multilayer system with high damage threshold (SiO2/TiO2, SiO2/Al2O3, , ...)
- diamond-like carbon layers (DLC)